Mission computing/data storage, powered enclosures, power conversions and avionics controls

Custom front panel, rear panel, cooling, single or hybrid technology backplanes, standard or custom power supply solutions for power capacity and voltage rails, system monitoring and board capacity options. 

Whether its high altitude situations or extreme thermal environments, effective avionics cooling is vital to prevent damage from minimized air flow and excessive heat. We eliminate overheating risk by performing thermal analysis on every system. Using native, solid-model CAD geometry, we produce a selection of shaded display, particle trace animation and clipping planes to optimize thermal performance. This analysis ensures that your thermal requirements are met early in the design process, dramatically shortening product delivery time.

After testing a variety of heat transfer types, we’ll implement a cooling solution based on specific board requirements. Our cooling solutions include:

• Convection (forced air): A filtered, right-sized air intake and baffle combined with high-efficiency fans provide generous airflow through the card cage and peripheral bay.
• Conduction: Precision-machined card guides in the sidewalls cool both circuit card assemblies and the power supply, conducting heat through this brazed inner structural member to the mounting interface.
• Liquid sidewall conduction: Liquid sidewall cooling is passed through precision-machined card guides in the sidewalls, cooling both circuit card assemblies and the power supply.

We'll combine or alter these cooling methods as necessary to suit your thermal management needs.